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  • DesignCon 2026

    Santa Clara Convention Center 5001 Great America Pkwy, Santa Clara, CA, United States

    Microsanj is exhibiting at DesignCon in Santa Clara, CA, at the Santa Clara Convention Center, taking place from February 24 to 26. 📍 Booth #1551

  • GEMIC 2026

    AUDIMAX, Campus South, Karlsruhe Institute of Technology , Germany

    Microsanj is pleased to announce that our international representative, HITECH, will be serving as a Silver Sponsor at the upcoming GEMIC 2026

  • Semi-Therm 2026

    DoubleTree by Hilton San Jose 2050 Gateway Pl, San Jose, CA, United States

    The SEMI-THERM Symposium is an annual conference dedicated to the thermal management, design, and characterization of electronic components and systems. It brings

  • GOMACTech 2026

    New Orleans Ernest N. Morial Convention Center 900 Convention Center Blvd, New Orleans, LA, New Orleans, CA, United States

    Microsanj is exhibiting at GOMACTech in New Orleans, LA, at the Ernest N. Morial Convention Center, taking place from March 9 to 12. 📍 Booth

  • Microsanj Open House

    Microsanj Headquarters 48421 Milmont Drive, Fremont, CA, United States

    Join us the evening before our Semi-Therm workshop for an interactive showcase of Microsanj’s transient thermoreflectance systems, IR/OpenTEST platform demonstrations, with hands-on

  • APEX 2026

    Anaheim Convention Center 800 W Katella Ave, Anaheim, CA, United States

    Microsanj is exhibiting at APEX 2026 in Anaheim, CA, at the Anaheim Convention Center, taking place March 14–19. 📍 Booth #4203 🕒 Exhibit Hours Tuesday, 3/17: 10:00

  • Industry Day and Birck Research Symposium 2026

    Birck Nanotechnology Center 1205 W State St, West Lafayette, IN

    Microsanj is proud to be a Gold Sponsor for the 2nd annual symposium. We will be exhibiting our latest systems and speaking

  • SEMIEXPO Heartland 2026

    Detroit Marriott at the Renaissance Center Renaissance Center, 400 Renaissance Dr W, Detroit, MI, United States

    Dr. Mo Shakouri will be a part of Session 3: Thermal Management & Power Delivery in Advanced Packaging: From TIMs to Warpage