As wireless communication technology advances, thermal management in RF, 5G, and 6G devices has become a critical factor in ensuring efficiency, reliability, and performance. With increasing power densities and high-frequency operation, proper thermal analysis is essential to prevent overheating, signal degradation, and device failure.

• High-Resolution Thermal Imaging – Detect localized heating in power amplifiers, antennas, and transceivers.
• Over-the-Air Thermal Mapping – Non-contact analysis of active RF components in real-world conditions.
• Transient Thermal Analysis – Capture nanosecond-scale heat dissipation events in RF circuits.
• Electrothermal Coupling Characterization – Understand how heat affects RF performance and signal integrity.
• Load Pull & On-Wafer Testing Integration – Evaluate thermal behavior under dynamic RF operating conditions. 

• 5G/6G Base Stations & Network Infrastructure – Ensure thermal stability of high-power RF modules.
• RF Power Amplifiers & Transceivers – Optimize heat dissipation for enhanced signal performance.
• Antenna Arrays & Phased-Array Systems – Analyze thermal effects in beamforming and MIMO technologies.
• Satellite & Defense Communications – Improve thermal reliability in high-frequency aerospace applications.
• IoT & Wearable RF Devices – Enhance heat management in compact, high-efficiency electronics.