Co-Packaged Optics (CPO)

Co-Packaged Optics (CPO) is an emerging technology that integrates optical and electrical components within the same package, reducing power consumption, latency, and thermal inefficiencies in high-performance computing (HPC), AI-driven data centers, and next-generation networking equipment. Unlike traditional pluggable optics, separate from the switching ASIC, CPO places photonic components closer to the chip, improving energy efficiency and higher data throughput.

As optical components and ASICs are densely co-packaged, heat dissipation becomes a significant challenge. Thermal issues in CPO designs can lead to:

• Performance degradation due to thermal-induced signal distortion.
• Device failure from excessive heating in integrated optical and electrical components.
• Reduced efficiency in high-speed interconnects operating at 100G, 400G, and beyond.

Microsanj’s high-resolution thermoreflectance and infrared thermal imaging solutions provide critical thermal insights for CPO device characterization and reliability testing.

• SanjSCOPE™ Thermoreflectance Systems – Nanosecond-scale, sub-micron resolution thermal mapping to detect heat buildup in optical waveguides, photonic ICs (PICs), and ASICs.
• irSCOPE™ Infrared Imaging – Non-contact, real-time infrared analysis for broader thermal monitoring of CPO assemblies.
• SanjVIEW™ Thermal Analysis Software – Comprehensive thermal modeling and data visualization, optimizing CPO designs for performance and longevity.
• POSH-TDTR Time-Domain Thermoreflectance – Advanced material characterization, evaluating thermal conductivity in optical and semiconductor interfaces. 

• AI & High-Performance Computing (HPC) – Ensuring efficient heat dissipation in co-packaged photonic and electronic systems.
• 5G & Data Centers – Enhancing thermal reliability in high-speed networking interconnects.
• Optoelectronics & Silicon Photonics – Enabling next-gen photonic integration with precise thermal analysis.