Microsanj’s IR+TR Hybrid System integrates Infrared (IR) thermal imaging with Thermoreflectance (TR) imaging, delivering a comprehensive solution for multi-scale, high-precision thermal analysis. By leveraging the strengths of both methods, this technology provides accurate, real-time temperature mapping across various materials and device architectures.

• Wide Thermal Imaging Range – IR excels in macroscopic thermal mapping, while TR provides sub-micron, high-resolution detail.
• Fast, Real-Time Thermal Characterization – Capture nanosecond-scale transient thermal events with high precision.
• Material Versatility – Works effectively on both emissive and non-emissive materials, making it ideal for semiconductor, RF, and photonics applications. 

• Multi-Scale Thermal Analysis – From large-area heat dissipation to localized thermal events.
• Enhanced Failure Analysis – Detect hotspots, thermal stress, and material inconsistencies.
• Optimized for Semiconductor & RF Testing – Ideal for 5G/6G, power electronics, and multi-layer ICs.
• Seamless Integration – Fully compatible with Microsanj’s SanjVIEW™ software and industry-standard testing platforms. 

• Semiconductor Packaging & IC Testing – Improve device reliability and heat dissipation strategies.
• RF & 5G/6G Device Characterization – Ensure efficient thermal management of antennas and power amplifiers.
• Photonics & Optoelectronics – Evaluate thermal properties in LEDs, laser diodes, and optical interconnects.
• Power Electronics & Advanced Materials – Study heat transfer in GaN, SiC, and novel material systems.