emSCOPE™ – RF Thermal Imaging
- Over-the-air-imaging for 5G/6G applications.
OPP-3DIC™ – 3DIC Thermal Analysis
- Multi-layer heat dissipation analysis.
PicoSCOPE™ – Ultrafast Thermal Characterization
- 500-picosecond resolution for high-speed applications.
POSH-TDTR™ – Thin-Film Conductivity Testing
- Essential for semiconductor and material research.
irFLASH™ – Lock-In Infrared Thermography
- High-sensitivity imaging for complex 3D structures.
IR+TR Hybrid System – Infrared + Thermoreflectance
- Combines both methods for comprehensive thermal mapping.