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SEMIEXPO Heartland 2026
Dr. Mo Shakouri will be a part of Session 3: Thermal Management & Power Delivery in Advanced Packaging: From TIMs to Warpage Control by presenting Meeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques on Thursday, April 30, from 10:05 AM – 10:25 AM.
SEMIEXPO Heartland 2026 brings together the automotive and semiconductor ecosystems to explore the technologies redefining mobility and manufacturing. From software-defined and self-driving vehicles to electrified mobility, the event highlights how cutting-edge chip technologies, smart sensing systems, and artificial intelligence are powering the next generation of transportation. Through a dynamic lineup of keynotes, expert presentations, and panel discussions, attendees will exchange perspectives on the trends shaping the future—while actively contributing to the conversation.