Microsanj’s high-resolution thermal imaging and material characterization technologies provide critical insights into heat dissipation, failure analysis, and reliability for advanced semiconductor materials. These materials are used in power electronics, RF, photonics, and AI computing, where precise thermal management is essential for performance and longevity.

Gallium Nitride (GaN) – High-Power & RF Applications

Why It Matters: GaN is a wide-bandgap (WBG) material with high power density and fast switching speeds, but it suffers from thermal dissipation challenges due to localized hotspots. Microsanj’s Solution:

• SanjSCOPE™ Thermoreflectance Imaging Systems – Detects sub-micron-scale hotspots in GaN transistors and RF amplifiers.
• POSH-TDTR™ Time-Domain Thermoreflectance – Characterizes GaN-substrate thermal interfaces to improve heat dissipation. Applications: 5G power amplifiers, RF transceivers, electric vehicle (EV) inverters, high-power electronics.

Silicon Carbide (SiC) – Power Electronics & EVs

Why It Matters: SiC is another WBG material with superior thermal conductivity, making it ideal for high-power switching in EVs and renewable energy systems. However, thermal stress and defects can lead to device failures. Microsanj’s Solution:

• irSCOPE™ Infrared Imaging – Monitors heat dissipation in high-power SiC MOSFETs and diodes.
• SanjVIEW™ Software – Tracks transient thermal behavior to improve reliability in power electronics. Applications: Electric vehicles (EVs), industrial power modules, solar inverters, aerospace power electronics.

Indium Phosphide (InP) – Photonics & Optoelectronics

Why It Matters: InP is used in lasers, photonic integrated circuits (PICs), and fiber-optic communications. Managing heat in these devices is critical for optical efficiency and signal integrity. Microsanj’s Solution:

• SanjSCOPE™ Thermoreflectance Imaging Systems – Identifies thermal hotspots in InP-based lasers and modulators.
• POSH-TDTR™ – Measures thermal conductivity in InP thin films and optical coatings. Applications: Data center photonics, LiDAR, high-speed optical transceivers, quantum computing.

Silicon Photonics (SiPh) – Co-Packaged Optics & Data Centers

Why It Matters: Si-based photonic circuits enable high-speed data transmission but suffer from thermal crosstalk and heat buildup in dense integration. Microsanj’s Solution:

• SanjSCOPE™ Thermoreflectance Imaging Systems – Detects sub-micron temperature fluctuations in silicon photonic waveguides.
• irSCOPE™ Infrared Imaging – Evaluates chip-level heat dissipation in co-packaged optics (CPO). Applications: High-performance computing (HPC), optical networking, AI chip interconnects.

Insulated-Gate Bipolar Transistors (IGBTs) – Power Switching Devices

Why It Matters: IGBTs are used in high-power applications, but their thermal stress and junction overheating can lead to efficiency loss and failure. Microsanj’s Solution:

• irFLASH™ Infrared Thermography – Provides non-contact, real-time thermal mapping of IGBT heat distribution.
• POSH-TDTR™ – Characterizes thermal resistance at IGBT interfaces for better cooling solutions. Applications: Industrial motor drives, rail traction, renewable energy power conversion.