Thermoreflectance Benefits

In the world of semiconductors, RF, power electronics, and emerging technologies, precise thermal management is critical. Traditional thermal imaging methods often fail to capture submicron temperature variations—the very flaws that can cause catastrophic failures. Microsanj’s thermoreflectance technology reveals the smallest thermal details at 250nm spatial resolution and 500 picosecond precision, allowing engineers to detect, analyze, and eliminate thermal defects before they become costly issues.In the world of semiconductors, RF, power electronics, and emerging technologies, precise thermal management is critical. Traditional thermal imaging methods often fail to capture submicron temperature variations—the very flaws that can cause catastrophic failures. Microsanj’s thermoreflectance technology reveals the smallest thermal details at 250nm spatial resolution and 500 picosecond, allowing engineers to detect, analyze, and eliminate thermal defects before they become costly issues. 

Microsanj’s thermoreflectance imaging offers significant advantages over traditional thermal testing methods like infrared and thermocouples:

• Unparalleled Resolution: Identify hot spots, defects, and heat flow patterns at the nanometer scale, ensuring precision thermal mapping for advanced electronics.
• Nanosecond-Scale Response: Detect rapid thermal transients that infrared cameras cannot capture, critical for RF, 5G, and AI chip analysis.
• Non-Contact & Non-Destructive: Unlike thermocouples or thermal probes, thermoreflectance does not interfere with device performance.
• Seamless Integration: Microsanj’s solutions work with existing failure analysis and semiconductor characterization tools, enhancing laboratory efficiency.

While infrared is effective for macroscale temperature detection, thermoreflectance is the preferred choice for detecting sub-micron hot spots, nanoscale defects, and transient thermal changes that drive reliability issues in modern electronics.

• Semiconductor Engineers – Detect failure points in ICs, transistors, and advanced chip packaging.
• RF & 5G Designers – Resolve thermal issues in GaN-based power amplifiers, phased-array antennas, and mmWave devices.
• AI & Quantum Computing Innovators – Optimize thermal performance in ultra-fast AI processors and cryogenic quantum chips.
• Power Electronics Specialists – Improve heat dissipation in GaN, SiC, and IGBT power modules.
• Photonics & Optoelectronics Engineers – Study heat flow in laser diodes, LEDs, and optical waveguides.