Thermal Interface Materials (TIMs) play a crucial role in transferring heat between electronic components and heat sinks. Their performance directly affects thermal resistance, heat dissipation efficiency, and overall device reliability. Precise TIMs testing ensures optimal material selection and long-term stability.

• High-Resolution Thermal Imaging – Detect hotspots and uneven heat distribution across TIM layers.
• Thermal Conductivity & Resistance Measurements – Evaluate how well TIMs transfer heat.
• Transient Thermal Analysis – Assess TIM degradation over time and under operational stress.
• Interface Characterization – Identify voids, delamination, and material inconsistencies.
• Non-Destructive Testing – Perform real-time analysis without altering the sample. 

• Semiconductor & IC Packaging – Improve thermal performance in high-power chips.
• Power Electronics & Automotive Systems – Optimize heat dissipation in IGBTs, GaN, and SiC devices.
• 5G/6G Infrastructure & RF Components – Enhance thermal management in high-frequency circuits.
• Aerospace & Defense Electronics – Ensure reliability in mission-critical power and communication systems.