The OPP-3DIC™ is an advanced optical pump-probe thermal imaging system designed for 3DIC packaging, multi-layer semiconductor devices, and complex thermal structures. This system provides high-resolution, layer-specific thermal characterization to ensure efficient heat dissipation and long-term reliability in densely integrated circuits.

• Layer-Selective Thermal Analysis – Evaluate individual layers in 3DIC, chiplets, and stacked die architectures.
• Ultra-High Spatial Resolution – Achieve sub-micron precision in thermal mapping.
• Transient & Steady-State Thermal Imaging – Analyze dynamic heat flow and steady-state conditions.
• Failure Detection & Process Optimization – Identify hotspots, material mismatches, and thermal stress.
• Seamless Integration with Semiconductor Testing Systems – Compatible with RF, photonics, and power electronics platforms..

• 3DIC & Chiplet Packaging – Optimize multi-layer thermal performance and interconnect reliability.
• Advanced Semiconductor Devices – Ensure efficient heat dissipation in high-power components.
• Photonics & Optoelectronics – Evaluate thermal properties of laser diodes, waveguides, and modulators.
• Heterogeneous Integration & MEMS – Analyze heat distribution in microelectromechanical and hybrid systems.

• Spatial Resolution: Sub-micron precision
• Temporal Resolution: Nanosecond-scale transient analysis
• Measurement Techniques: Optical pump-probe thermal imaging
• Software Compatibility: Fully integrated with SanjVIEW™ for multi-layer thermal diagnostics