Evolving strategy and new products to address emerging thermal challenges driven by advances in heterogeneous packaging and embedded antennas with Optical Pump-Probe imaging, Flash Thermography, 500 ps transient resolution, and emSCOPE™, an electromagnetic to thermal energy transducer for analysis of embedded antennas.

The year 2024 marked the 15th anniversary of the first commercially available thermoreflectance system from Microsanj.

Microsanj enters alliances with eV-Technologies and MPI Corporation to broaden applications for thermoreflectance and infrared Imaging. The eV-Technologies alliance with Spin-Crossover materials provides a means for near and far-field over-the-air imaging of embedded microwave and millimeter-wave antennas. With MPI, Microsanj SanjSCOPE products address auto-wafer thermal testing.

Microsanj introduces the SanjSCOPE™ EZ-THERM Series, a compact modular thermal imaging platform that can be integrated with an existing semiconductor test system and will simultaneously support up to three imaging sensors.

Microsanj SanjSCOPE™ Thermal Imaging product line now comprises standard turnkey systems with multiple options to fit a wide range of customer thermal imaging performance requirements and applications. Introduced the first fully integrated Thermoreflectance + Infrared dual-mode thermal imaging system.

More than 100 papers published, establishing Microsanj as a technology leader in the thermal imaging field.

Introduced several new key system features: TransientCAL™ for extended spatial resolution, hyperspectral imaging for enhanced temperature accuracy, and 3D nano-align for thermal drift compensation. Introduced a standalone post-data processing package, SanjANALYZER-PLUS™, to support the latest features and added flexibility.

Introduction of NT410 (now PT410) Thermal Imaging System providing 800 ps time resolution with sub-micron spatial resolution.

Introduction of NT310 Near-IR Thermal Imaging System for flip-chip and through-the-substrate imaging.

Establishment of sales/support network. We now have sales and technical support in Asia, Europe, Israel, Brazil, Canada, and the United States.

Formed a collaborative relationship with Thermal Engineering Associates (TEA) and Packaging Science Services (PSS). Known as the Microelectronic Design and Measurement Group (MDaM), this partnership provides a resource for a wide range of microelectronic design services.

Offered first commercial thermal imaging system based on the thermoreflectance technique.

The company was founded in the heart of Silicon Valley, Santa Clara, California.