In industries where precision and reliability are paramount, non-destructive thermal analysis is a game-changer. Traditional thermal testing methods often involve physical contact, invasive probes, or sample destruction, altering the very devices they aim to analyze. Microsanj’s thermoreflectance and infrared-based solutions provide a completely non-contact, non-invasive approach, allowing researchers and engineers to detect, analyze, and optimize thermal behavior without compromising device integrity.

• Preserves Device Integrity: Perform precise thermal analysis without damaging delicate structures or altering test conditions.
• Detects Micro-Scale Thermal Anomalies: Identify hotspots, stress points, and heat dissipation issues at the sub-micron scale.
• Compatible with Fragile Materials: Ideal for thin films, MEMS devices, semiconductor wafers, and high-frequency RF components.
• High-Speed, High-Resolution Imaging: Capture nanosecond-scale thermal transients, crucial for failure analysis and reliability testing.
• Seamless Integration with Testing Workflows: Works alongside electrical characterization, RF testing, and optical diagnostics. 

• Semiconductor Engineers – Detect failure points in ICs, transistors, and advanced packaging.
• RF & 5G Designers – Evaluate heating in high-frequency power amplifiers and phased arrays.
• AI & Quantum Computing Experts – Analyze cryogenic and high-speed AI chip performance.
• Power Electronics Researchers – Measure thermal efficiency in GaN, SiC, and IGBT devices.
• Photonics & Optoelectronics Scientists – Study heat transfer in laser diodes and LEDs.