3D-PEIM will convene leading technical experts and industry stakeholders to explore the latest advancements in 3D power electronics integration and manufacturing. Over
The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing,
The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT
The 25th Chitose International Forum on Science & Technology (CIF25) will be held at Chitose Institute of Science and Technology (CIST), Hokkaido,
European Microwave Week (EuMW) 2025 is Europe’s premier event dedicated to microwave, RF, wireless, and radar technologies. EuMW 2025 will feature three cutting-edge
PAINE Conference brings together researchers and practitioners from academia, industry, and government to discuss advancements in hardware security, physical inspection, and supply
InterPACK is the premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and
Join us for the 51st International Symposium for Testing and Failure Analysis (ISTFA) is set to take place in Pasadena, California, from
The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by