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InterPACK 2025
October 28, 2025 - October 30, 2025
As a Silver Sponsor of InterPACK, the premier international conference on electronics packaging and heterogeneous integration, Microsanj will showcase live demonstrations of its POSH-TDTR platform and GaN thermal analysis solutions.
Conference attendees can experience firsthand how Microsanj’s tools deliver high-resolution insights for addressing device and packaging-level thermal challenges.