IMPACT 2025
IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI
IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI
As a Silver Sponsor of InterPACK, the premier international conference on electronics packaging and heterogeneous integration, Microsanj will showcase live demonstrations of
The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges
Microsanj will join the 51st International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena, CA. As the premier event for the
The IEEE Electronics Packaging Technology Conference (EPTC), the flagship IEEE EPS conference in the Asia-Pacific region, will be held in Singapore. Microsanj
IEEE Microwaves, Antennas and Propagation Conference (IEEE MAPCON 2025) will be held at Lulu International Convention Centre, Grand Hyatt Bolgatty, Kochi (India) from December 14 –
Microsanj is starting the year strong by exhibiting at Radio Wireless Week (RWW) in Los Angeles / Hollywood at the Loews Hollywood Hotel, taking place January
Our Co-Founder and CEO, Mo Shakouri, along with our partner MPI and our Korea representatives, ENSSEL and ROIENTEC CO., LTD., will be
Microsanj is exhibiting at DesignCon in Santa Clara, CA, at the Santa Clara Convention Center, taking place from February 24 to 26. 📍 Booth #1551
Microsanj is pleased to announce that our international representative, HITECH, will be serving as a Silver Sponsor at the upcoming GEMIC 2026