PAINE Conference brings together researchers and practitioners from academia, industry, and government to discuss advancements in hardware security, physical inspection, and supply
InterPACK is the premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and
Join us for the 51st International Symposium for Testing and Failure Analysis (ISTFA) is set to take place in Pasadena, California, from
The IEEE Electronics Packaging Technology Conference (EPTC) is an annual international event organized by the IEEE RS/EPS/EDS Singapore Chapter and co-sponsored by