Trade Shows

The IEEE PAINE Conference brings together researchers and practitioners from academia, industry, and government to address advances in hardware security, inspection, and

IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI

As a Silver Sponsor of InterPACK, the premier international conference on electronics packaging and heterogeneous integration, Microsanj will showcase live demonstrations of

The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges

Microsanj will join the 51st International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena, CA. As the premier event for the

The IEEE Electronics Packaging Technology Conference (EPTC), the flagship IEEE EPS conference in the Asia-Pacific region, will be held in Singapore. Microsanj

IEEE Microwaves, Antennas and Propagation Conference (IEEE MAPCON 2025) will be held at Lulu International Convention Centre, Grand Hyatt Bolgatty, Kochi (India) from December 14 –

Microsanj is starting the year strong by exhibiting at Radio Wireless Week (RWW) in Los Angeles / Hollywood at the Loews Hollywood Hotel, taking place January

Our Co-Founder and CEO, Mo Shakouri, along with our partner MPI and our Korea representatives, ENSSEL and ROIENTEC CO., LTD., will be

Microsanj is exhibiting at DesignCon in Santa Clara, CA, at the Santa Clara Convention Center, taking place from February 24 to 26. 📍 Booth #1551