Our Week at IMS 2026
What a week! From June 8–11, the global RF and microwave community gathered in Boston for the IEEE International Microwave Symposium (IMS) and Microsanj was right in the middle of it. Across a hands-on workshop, three full days on the exhibition floor, and a MicroApps presentation, we shared what’s next in high-resolution thermal characterization and connected with engineers, researchers, and industry leaders from around the world. Here’s a look back at everything we got up to.
A Workshop on the Future of RF Thermal Management
On Monday, June 8, we hosted Advanced Thermal Management in RF Systems: From Wide-Bandgap Materials to Industrial Implementation, a half-day workshop exploring the future of thermal design in high-power RF and microwave applications. The program brought together leading voices from Stanford University, the University of Connecticut, GlobalFoundries, Université Catholique de Louvain, DARPA, and Microsanj. Sessions spanned wide-bandgap materials, transient thermal dynamics, advanced modeling, self-heating mitigation, and thermoreflectance imaging, culminating in a holistic, system-level approach to thermal-electromagnetic co-design.
We were proud to share the stage with an outstanding lineup of speakers:
- Prof. Srabanti Chowdhury — Stanford University (Presented by Dr. Kelly Woo)
- Prof. Georges Pavlidis — University of Connecticut
- Oscar D. Restrepo — GlobalFoundries
- Prof. Jean-Pierre Raskin — Université Catholique de Louvain (Presented by Martin Vanbrabant)
- Yogendra Joshi — DARPA
- Mo Shakouri — Microsanj LLC
Three Days on the Exhibition Floor
For three full days, our booth (#12027) was a hub of activity. Visitors stopped by for live demonstrations of our SanjSCOPE™ thermoreflectance imaging systems, including our OpenTest™ and GaN demos, plus a joint demonstration with the University of Wisconsin on antenna thermal analysis. Between demos, engineers talked through their real-world thermal challenges across GaN, HEMT, 5G, power electronics, and photonics applications. Watching them see sub-micron thermal maps of their own devices light up never gets old.
Our MicroApps Presentation
On Tuesday, June 9, at the MicroApps Theater, Microsanj’s Dr. Mo Shakouri presented Advances in Thermal Analysis to Address the Growing Thermal Challenges of 3D Heterogeneous Integration. The short, focused format made for great questions and even better conversations afterward at the booth.
Coming Together as a Team
IMS week wasn’t all demos and presentations. We also made time for a team dinner to unwind, celebrate a great show, and simply enjoy each other’s company. Moments like these away from the booth are a big part of what keeps our team close, energized, and ready to take on the next challenge together.
A Truly Global Audience
One of the real highlights of the week was just how far people traveled to learn what we do. We had the pleasure of meeting engineers, researchers, and partners from across the globe, all sharing a common drive to push the limits of thermal characterization. The curiosity and enthusiasm around Microsanj’s technology, from every corner of the RF and semiconductor world, reminded us exactly why we love this field.
Keep the Conversation Going
Didn’t make it to Boston, or want to keep the conversation going? We’d love to show you what our systems can do with your devices.