Technical Webinar
Multiphysics Characterization of GaN and Wide‑Bandgap RF Devices: Correlating Pulsed‑IV, RF, and Thermoreflectance Thermal Imaging Measurements
Exploring how multiphysics approaches are unlocking new understanding of GaN, SiC, and next-generation semiconductor devices.
Why This Webinar Matters
Semiconductor devices’ ultimate performance and failure are often determined by multiphysics interactions. GaN and SiC devices are pushed harder than ever — higher frequencies, higher power densities, higher operating temperatures. No single measurement tells the full story. RF performance, pulsed IV behavior, and thermal dissipation are coupled phenomena. This webinar brings together researchers with real data showing what multiphysics characterization reveals that single-domain measurements miss.
- Electrothermal coupling is real – RF gain, noise figure, and reliability all degrade with temperature — but the coupling is nonlinear and hot spots play a key role. Measuring thermally without an RF context leaves critical information on the table.
- Pulse IV reveals what DC hides – pulsed measurements isolate the intrinsic device behavior from self-heating and trap effect, giving a cleaner picture of what's really limiting performance.
- Thermal imaging closes the loop – Full-field thermoreflectance imaging maps where the heat actually goes, validating models, identifying hotspots, and connecting device behavior to reliability outcomes.
What you’ll learn
From measurement to understanding:- How RF, pulse IV, and thermal measurements are connected — and why characterizing them together can be very powerful to better understand device performance and failure mechanisms.
- Real RF and thermal multiphysics data from GaN devices — results from Colorado School of Mines showing what correlated measurements reveal
- Full-field thermoreflectance thermal imaging in a multiphysics workflow
- Wide bandgap device reliability — thermal degradation mechanisms in GaN and SiC, and how multiphysics data connects measurements to failure modes
- MPI with load-pull capabilities — how pulsed IV and RF measurement hardware integrates with thermal characterization systems in a correlated workflow
- Practical guidance for your lab — what a multiphysics characterization workflow looks like and how to get started with existing equipment
Speakers
Dr. Ali Shakouri
Inventor of the optical sampling technology behind Microsanj's NOSH-TDTR and POSH-TDTR platforms, Ali leads the company's core technology development.
Prof. Peter Aaen
EE Department Head at Colorado School of Mines, formerly with University of Surrey, and National Physical Laboratory.
Prof. Samuel Graham
Dean of the University of Maryland Clark School since 2021, Samuel Graham Jr. is a Georgia Tech–trained mechanical engineer and NSF CAREER Award recipient.
Vincent Mallette
Newly appointed Director of Global Sales and Marketing at MPI Corporation's Advanced Semiconductor Test Division, with 20+ years of industry experience.
Dustin Kendig
Leading the engineering department responsible for designing sub-micron thermal imaging systems for 5G, satellite, and power electronics applications.