TFAWS 2025
The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing,
The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing,
The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT
The 25th Chitose International Forum on Science & Technology (CIF25) will be held at Chitose Institute of Science and Technology (CIST), Hokkaido,
European Microwave Week (EuMW) 2025 is Europe’s premier event dedicated to microwave, RF, wireless, and radar technologies. EuMW 2025 will feature three cutting-edge
The IEEE PAINE Conference brings together researchers and practitioners from academia, industry, and government to address advances in hardware security, inspection, and
IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI
As a Silver Sponsor of InterPACK, the premier international conference on electronics packaging and heterogeneous integration, Microsanj will showcase live demonstrations of
The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges
Microsanj will join the 51st International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena, CA. As the premier event for the
The 2025 IEEE REPP is a two-day technical event focused on Reliability for Electronics and Photonics Packaging and is taking place at