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  • IMS 2025

    Moscone Center 747 Howard St, San Francisco, CA, United States

    IMS 2025 (IEEE MTT-S International Microwave Symposium) is the premier global event for professionals in the RF, microwave, and millimeter-wave industries. IMS

  • 3D-PEIM 2025

    Sheraton Denver West Hotel 360 Union Blvd, Lakewood, CO, United States

    3D-PEIM will convene leading technical experts and industry stakeholders to explore the latest advancements in 3D power electronics integration and manufacturing. Over

  • TFAWS 2025

    Diaz Compean Student Union One Washington Sq, San Jose, CA, United States

    The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing,

  • ICEPT 2025

    Sheraton Shanghai Jiading Hotel 66 Jiatang Hwy, Jiading District, Shanghai, China

    The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT

  • Chitose International Forum on Science & Technology 2025

    Chitose Institute of Science and Technology 758-65 Bibi, Chitose, Hokkaido, Japan

    The 25th Chitose International Forum on Science & Technology (CIF25) will be held at Chitose Institute of Science and Technology (CIST), Hokkaido,

  • EuMW 2025

    Jaarbeurs Convention Centre Jaarbeursplein 6, 3521 AL, Utrecht, Netherlands

    European Microwave Week (EuMW) 2025 is Europe’s premier event dedicated to microwave, RF, wireless, and radar technologies. EuMW 2025 will feature three cutting-edge

  • IEEE PAINE 2025

    Denver Marriott Westminster 7000 Church Ranch Boulevard, Westminster, CO, United States

    The IEEE PAINE Conference brings together researchers and practitioners from academia, industry, and government to address advances in hardware security, inspection, and

  • IMPACT 2025

    5F Taipei Nangang Exhibition Center (Hall 1) No.1, Jingmao 2nd Rd., Nangang District, Taipei City, Taiwan

    IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI

  • InterPACK 2025

    Hotel FERA Anaheim, a DoubleTree by Hilton 100 The City Dr S, Orange, CA, United States

    As a Silver Sponsor of InterPACK, the premier international conference on electronics packaging and heterogeneous integration, Microsanj will showcase live demonstrations of

  • PIC Summit Europe

    Evoluon Noord Brabantlaan 1A 5652, LA Eindhoven, Netherlands

    The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges