IEEE PAINE 2025
The IEEE PAINE Conference brings together researchers and practitioners from academia, industry, and government to address advances in hardware security, inspection, and
The IEEE PAINE Conference brings together researchers and practitioners from academia, industry, and government to address advances in hardware security, inspection, and
IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI
As a Silver Sponsor of InterPACK, the premier international conference on electronics packaging and heterogeneous integration, Microsanj will showcase live demonstrations of
The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges
Microsanj will join the 51st International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena, CA. As the premier event for the
The 2025 IEEE REPP is a two-day technical event focused on Reliability for Electronics and Photonics Packaging and is taking place at
The IEEE Electronics Packaging Technology Conference (EPTC), the flagship IEEE EPS conference in the Asia-Pacific region, will be held in Singapore. Microsanj
IEEE Microwaves, Antennas and Propagation Conference (IEEE MAPCON 2025) will be held at Lulu International Convention Centre, Grand Hyatt Bolgatty, Kochi (India) from December 14 –
Microsanj is starting the year strong by exhibiting at Radio Wireless Week (RWW) in Los Angeles / Hollywood at the Loews Hollywood Hotel, taking place January
Our Co-Founder and CEO, Mo Shakouri, along with our partner MPI and our Korea representatives, ENSSEL and ROIENTEC CO., LTD., will be