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  • ITherm 2025

    Gaylord Texan Resort & Convention Center 1501 Gaylord Trail, Grapevine, TX, United States

    ITherm 2025 will be held along with the 75th Electronic Components and Technology Conference (ECTC 2025 – http://www.ectc.net), a premier electronics packaging conference at

  • BITS & Chips Benelux RF Conference 2025

    Mikrocentrum De Run 1115, 5503 LB De Run 1115, 5503 LB, Veldhoven, Netherlands

    The BITS & Chips Benelux RF Conference 2025 brings together industry experts to explore the latest advancements in RF technology. The event

  • IMS 2025

    Moscone Center 747 Howard St, San Francisco, CA, United States

    IMS 2025 (IEEE MTT-S International Microwave Symposium) is the premier global event for professionals in the RF, microwave, and millimeter-wave industries. IMS

  • ICEPT 2025

    Sheraton Shanghai Jiading Hotel 66 Jiatang Hwy, Jiading District, Shanghai, China

    The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT

  • Chitose International Forum on Science & Technology 2025

    Chitose Institute of Science and Technology 758-65 Bibi, Chitose, Hokkaido, Japan

    The 25th Chitose International Forum on Science & Technology (CIF25) will be held at Chitose Institute of Science and Technology (CIST), Hokkaido,

  • EuMW 2025

    Jaarbeurs Convention Centre Jaarbeursplein 6, 3521 AL, Utrecht, Netherlands

    European Microwave Week (EuMW) 2025 is Europe’s premier event dedicated to microwave, RF, wireless, and radar technologies. EuMW 2025 will feature three cutting-edge

  • IEEE PAINE 2025

    Denver Marriott Westminster 7000 Church Ranch Boulevard, Westminster, CO, United States

    The IEEE PAINE Conference brings together researchers and practitioners from academia, industry, and government to address advances in hardware security, inspection, and

  • IMPACT 2025

    5F Taipei Nangang Exhibition Center (Hall 1) No.1, Jingmao 2nd Rd., Nangang District, Taipei City, Taiwan

    IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI

  • InterPACK 2025

    Hotel FERA Anaheim, a DoubleTree by Hilton 100 The City Dr S, Orange, CA, United States

    As a Silver Sponsor of InterPACK, the premier international conference on electronics packaging and heterogeneous integration, Microsanj will showcase live demonstrations of

  • PIC Summit Europe

    Evoluon Noord Brabantlaan 1A 5652, LA Eindhoven, Netherlands

    The photonic chip industry is reaching new heights - but scaling production, applications, and investments requires a united effort. As demand surges