Why this matters

The transition to 3D heterogeneous integration has fundamentally changed the thermal characterization problem. Buried heat sources, anisotropic thin-film materials, through-silicon vias, and multilayer stacked structures require measurement techniques with sub-micron spatial resolution, depth sensitivity, and a temporal range — capabilities that infrared thermography and Raman spectroscopy cannot reliably deliver at this level of structural complexity.

This session presents optical sampling thermoreflectance as a practical, commercially available solution, with real measurement data from a university lab and an industrial FA environment.

What you’ll learn

• The pump-probe TDTR framework underlying nanosecond and picosecond optical sampling — and when each regime applies
• Full-field megapixel lock-in thermoreflectance for die-level hot spot detection in 3D stacked structures
• Single-point transient analysis for in-plane and cross-plane thermal conductivity extraction in bulk materials, thin films, and multilayer structures
• Measurement results from wide bandgap device characterization — GaN, SiC, and related materials
• Industry failure analysis and reliability workflows where optical sampling replaces destructive physical analysis
• Deployment options, upgrade paths, and testing services for getting started

Who Should Attend

• Thermal and packaging engineers working on 3D chip stacks, chiplets, and heterogeneous integration
• Failure analysis engineers looking to reduce or eliminate destructive cross-section workflows
• Reliability engineers characterizing thermal degradation in GaN, SiC, and InP devices
• Materials scientists and process engineers who need measured thermal property data — not bulk assumptions
• Thermal modeling engineers whose compact models depend on accurate thin-film material inputs
• University and national lab researchers working on next-generation power, photonics, or semiconductor devices

Speakers