IMPACT 2025

IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge,” reflecting the industry’s increasing focus on high-performance, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB, IC substrates, heterogeneous integration, and packaging technologies has become increasingly critical.

Presentation Announcement
Speaker: Andrew Tay
Session: S15 – Power Electronics
Date & Time: Wednesday, October 22 | 10:10–10:40 AM
Title: Thermal and Failure Analysis of Advanced Microelectronic Devices

Our rep, Andrew Tay, will explore advanced thermal analysis techniques for today’s high-power, miniaturized devices. His talk highlights how thermoreflectance thermography enables sub-micron, picosecond-resolution mapping to reveal hotspots and characterize thermal behavior non-destructively. He will also present a novel method using quantum spin crossover (SCO) materials to correlate electromagnetic power with temperature—offering a faster, cost-effective approach for antenna field analysis—supported by real-world case studies.