The emSCOPE™ is a specialized RF thermal imaging system designed for real-time, over-the-air thermal characterization of 5G/6G communication devices. By integrating advanced thermoreflectance technology with RF measurement tools, emSCOPE™ provides unparalleled insight into heat dissipation, component reliability, and antenna efficiency in next-generation wireless systems.

• Over-the-Air Thermal Imaging – Non-invasive thermal analysis of wireless and RF components.
• Optimized for High-Frequency Devices – Tailored for 5G/6G antennas, RF amplifiers, and transceivers.
• Ultra-High-Speed Detection – Capture nanosecond-scale transient thermal events.
• Enhanced Failure Analysis – Detect hotspots, signal integrity issues, and component stress.
• Seamless Integration with RF Testing Systems – Compatible with load pull, on-wafer RF, and pulse-IV analysis.

• 5G/6G Wireless Infrastructure – Ensure efficient heat dissipation in network hardware.
• RF Power Amplifiers & Antennas – Optimize thermal performance in high-frequency applications.
• Aerospace & Defense Communications – Improve radar, satellite, and secure communication systems.
• IoT & Wearable Devices – Analyze thermal behavior of compact, high-density electronic systems.

• Spatial Resolution: Sub-micron thermal mapping
• Temporal Resolution: Nanosecond-scale transient analysis
• Measurement Techniques: Over-the-air thermoreflectance imaging
• Software Compatibility: Fully integrated with SanjVIEW™ for RF thermal diagnostics