IEEE-IDSPS 2026
December 6 - December 9
The IEEE-IDSPS conference covers all design, semiconductor, packaging, and system technologies from science to technology to manufacturing, supporting India’s transition into a product nation.
Our Co-Founder & CEO, Mo Shakouri, will be presenting “Meeting Emerging Thermal Challenges of 3D Heterogeneously
Integrated Circuit Packaging Techniques.” Please check back here for more details.