- This event has passed.
ECTC 2026
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components, and microelectronic systems science, technology, and education in an environment of cooperation and technical exchange. ECTC is sponsored by the IEEE Electronics Packaging Society (formerly CPMT).
We’re proud to announce our sponsorship of the 2026 IEEE EPS Heterogeneous Integration Roadmap (HIR) Workshop at ECTC in Orlando, FL.
This full-day workshop on Tuesday, May 26 brings together leaders in advanced packaging to discuss the technologies shaping our industry’s future. The day features four technical sessions covering topics including Additive Electronics Manufacturing (AME) for Advanced Packaging and CHIPS R&D Metrology, chaired by Ravi Mahajan of Intel Corporation and William Chen of ASE.
As thermal imaging plays an increasingly critical role in heterogeneous integration and advanced packaging, Microsanj is honored to support the important work happening in this space.