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ASPS 2026
August 26 - August 28
Microsanj’s Korea representative, ROIENTEC, is exhibiting at the Advanced Semiconductor Packaging & Chiplet Show (ASPS) 2026, and we’d love to see you there.
ASPS gathers South Korea’s packaging community around the technologies driving the industry forward: advanced packaging, chiplets, and HBM. As devices move to 3D heterogeneous integration, understanding heat flow inside the package is more critical than ever.
Stop by Booth L109 to see how Microsanj’s thermoreflectance platforms deliver:
- Sub-micron, full-field thermal imaging of active devices and stacked die
- Depth-resolved characterization of TSVs, interposers, and TIMs
- In-plane & cross-plane thermal conductivity of thin films and packaging materials
The ROIENTEC team and Microsanj Co-Founder & CEO Dr. Mo Shakouri will be on hand to discuss your packaging and thermal challenges.