Uncovering the journey that electro-optical component testing takes from early-stage R&D through to high-volume manufacturing, and what that transition demands from probe and test infrastructure. As photonic integration moves from the lab into production lines, the measurement tools, automation requirements, and yield learning processes change fundamentally. Lawrence will share MPI's perspective on what it takes to make that scale-up work, with a look at the quantum computing and photonics ecosystem emerging right here in New Mexico.

The evolution toward 5G and the anticipation of 6G are driving profound changes in RF measurement. As semiconductor technology rapidly advances into the sub-THz domain, accurate measurements become paramount for effective modeling, simulation, and circuit design. This talk will address these critical aspects, exploring challenges in on-wafer characterization, calibration methods, improved probe technology, small- and large-signal analysis for transistors (especially non-50 Ohm), and the increasing demands for signal integrity and LNA performance in applications such as LEO satellite communications, remote sensing, and quantum computing, where precise noise measurements are essential.

An overview of Keysight's VNA portfolio including the new PNA-X Pro to 67GHz, 250GHz Frequency Extenders and its new Noise Figure Option

Learn what full-field thermoreflectance imaging and materials characterization actually reveal inside advanced semiconductor devices, from sub-micron gate hotspots in GaN RF transistors to thermal boundary resistance in photonic packages and thin-film conductivity in novel substrates. The talk covers Microsanj's three-pillar platform across thermal imaging, materials characterization, and multiphysics measurement with real measurement data from GaN, silicon photonics, and 3DHI applications. Practical, device-level, and directly relevant whether you're working on RF power, photonic integration, or advanced packaging.

Gel-Pak has partnered with the world’s leading semiconductor, medical, and electronics companies since 1980. Our manufacturing expertise enables us to customize existing products or rapidly develop novel solutions to meet the evolving requirements of next-generation technologies. Gel-Pak Representatives will demonstrate the latest product offerings for efficient holding and transport of your critical devices, wafers, and components, including the innovative “Bioinspired Textured Film Universal Carriers."

• Focus Microwaves: Pulsed IV
• Keysight: Signal Generators, Oscilloscopes, PNAx
• Microsanj: High Power GaN Thermal Imaging
• Gel Pak: Universal JEDEC Trays, WPX (pocketless waffle pack replacement)
• MPI: Probing solution: RF Probes, multi-contact probes, positioners, etc