Handouts
Advanced Thermal Imaging Solutions for Microelectronics and Optoelectronic Applications
Articles
Most Recent Papers
High-speed thermal imaging can resolve short RF pulse effects in tissue models
Top Papers
Accurate Thermoreflectance Imaging of Nano-Features Using Thermal Decay
Physical Origins of Current and Temperature Controlled Negative Differential Resistances in NbO2
Full-Field Thermal Imaging of Quasiballistic Crosstalk Reduction in Nanoscale Devices
Sub-Diffraction Thermoreflectance Thermal Imaging using Image Reconstruction
ESD Devices
High Speed Thermal Characterization of ESD Protection Devices
Failure Analysis
Ensuring Advanced Semiconductor Device Reliability using FA and Submicron Defect Detection
Imaging Failures in Sub-Micron Devices and Measuring Stresses in 3D ICs
GaN
UV Thermal Imaging of RF GaN Devices with GaN Resistor Validation
Thermal Modeling and Characterization of a Gallium Arsenide Power Amplifier MMIC
Recent Advances in GaN Power HEMTs Related to Thermal Problems and Low-Cost Approaches
Thermal Transport in Transistors Based on GaN and Novel 2D Materials
Multiphysics measurements of GaN Power Microwave Transistors
Transient Thermal Characterization of AlGaN/GaN HEMTs Under Pulsed Biasing
IGBT’s
Observation of Current Filaments in IGBTs with Thermoreflectance Microscopy
Logic_ICs
Transient Thermal Measurement and Behavior of Integrated Circuits
Nano Features Re-TransientCAL
Accurate Thermoreflectance Imaging of Nano-Features Using Thermal Decay
Optical Pump Probe
Optical Pump-Probe Thermoreflectance Imaging for Anisotropic Heat Diffusion
Optoelectronics
Transient Thermal Imaging Characterization of a Die Attached Optoelectronic Device on Silicon
RF Microwave
Hyperspectral Thermoreflectance Imaging for AlGaN/GaN Power HEMTs
Thermal Modeling and Characterization of a Gallium Arsenide Power Amplifier MMIC
Analyzing the Thermal Behavior of Advanced Microwave Devices & ICs
Application Notes
Comparing Thermoreflectance with Infrared Imaging for the Thermal Characterization of Electronic and Optoelectronic Devices
AN-001
Preparing Device Samples for Thermal Analysis and Thermal Mapping Using the Thermoreflectance Imaging Analyzer
AN-002
Understanding the Thermoreflectance Coefficient: The Key to Achieving Optimal Temperature & Spatial Resolution for Thermal Imaging of Microelectronic Devices
AN-003
Comparing Thermoreflectance (TTI), Infrared (IR), Near Infrared Emission (EMMI), and Optical Beam Induced Resistance Change (OBIRCH) Imaging Techniques
AN-004
Detecting Hot-Spots and Other Thermal Defects on a Sub-Micron Scale in Electronic and Optoelectronic Devices
AN-005
Analysis of Time-Dependent Thermal Events in High Speed Logic Integrated Circuits
AN-006
Through-the-Substrate Imaging Enables Flip Chip Thermal Analysis
AN-007
Tech Notes
Thermoreflectance Imaging: What is it?
TN-001A
Thermoreflectance Thermal Imaging (TTI) & Infrared Microscopy (IR): A Comparative Overview
TN-001B
Locating Defects in Sub-micron High Electron Mobility Transistors (HEMTs)
TN-002
Characterizing Non-uniform Temperature & Current Distributions in SCR for ESD Protection
TN-003
Thermal Characterization of High-power In-line Transistor Arrays
TN-004