- This event has passed.
IEEE PAINE 2025
The IEEE PAINE Conference brings together researchers and practitioners from academia, industry, and government to address advances in hardware security, inspection, and supply chain assurance of electronics.
As a Platinum Sponsor, Microsanj will host a booth highlighting its newly released POSH-TDTR ultrafast thermoreflectance system, designed for advanced thermal characterization.
In addition, Mo Shakouri, Ph.D., Founder & CEO of Microsanj, will deliver the talk:
“Buried Truths: Limitations and Opportunities in Non-Invasive Thermal Analysis for 2.5D/3D ICs” — offering insights into the opportunities and challenges of optical thermal analysis for reliability assurance and failure analysis of advanced integrated circuits.
“IEEE PAINE brings together metrologists, security researchers, and test houses to explore the latest industry trends. We’re thrilled to have Microsanj showcase their exciting work with our community.”
— Navid Asadi, Associate Professor, Electrical and Computer Engineering, University of Florida (affiliated with the Materials Science and Engineering Department)