Microsanj Seminar at ASU: Fueling the Future of Semiconductor Innovation
This week, Microsanj had the privilege of hosting a thermal metrology seminar at Arizona State University’s MacroTechnology Works facility—an innovation hub at the forefront of semiconductor and advanced packaging technologies. The April 21 event, held in collaboration with the Southwest Advanced Prototyping (SWAP) Hub, brought together industry experts, researchers, and students to explore the critical role of thermal analysis in high-performance electronics.
Event Recap and Highlights
Microsanj’s team showcased the latest advances in thermoreflectance metrology, emphasizing how high-resolution thermal systems are enabling breakthroughs in device design, failure analysis, and reliability testing. Dr. Mo Shakouri, CEO and Co-founder, led a deep dive into the capabilities of Microsanj’s EZ-THERM and NanoTHERM systems, which provide non-invasive, high-speed thermal characterization essential for today’s GaN, GaAs, and Si-based devices.
Attendees learned how these solutions deliver:
- 250 nm spatial resolution—revealing submicron hotspots and nanosecond-scale thermal events that traditional infrared methods cannot detect.
- 500 picosecond transient response—capturing ultra-fast thermal dynamics crucial for advanced packaging, chiplets, high-power RF, and AI hardware.
- Non-destructive, real-time mapping—enabling accurate analysis without altering or damaging devices.
The seminar covered a wide range of applications, including:
- Semiconductor device analysis and failure detection
- Advanced packaging (TSVs, stacked die), 3D integration, and heterogeneous systems
- RF, 5G/6G, and high-frequency device optimization
- Photonics, optoelectronics, and waveguide characterization
- Power electronics and thermal interface materials
- Microelectronics security, defect mapping, and biomedical imaging
- AI and quantum computing platforms, where thermal management is foundational for stability and performance.
Collaboration and Vision
A special thanks goes to Professor Chris Baily and the ASU team for their vision and leadership in semiconductor innovation. ASU’s strategic initiatives in advanced packaging, 3D integration, and heterogeneous systems are fostering a collaborative ecosystem that bridges academic research and real-world applications.
The event’s interactive Q&A and networking session underscored the importance of partnerships between technology providers, research institutions, and industry consortia like the SWAP Hub. Together, these collaborations are driving progress in microelectronics and supporting U.S. competitiveness in the global semiconductor landscape.
Looking Forward
Microsanj is proud to partner with ASU in advancing the next wave of innovation in thermal metrology. As the world of electronics rapidly evolves, thermal performance is no longer optional—it’s foundational. Our team remains committed to supporting the microelectronics community with advanced tools and expertise, and we look forward to future collaborations that push the boundaries of what’s possible.
For those who could not attend or wish to learn more, Dr. Shakouri’s presentation slides are available upon request. Contact info@microsanj.com for details or to schedule a demonstration.
Thank you to everyone who participated and helped make this event a success. Together, we are fueling the future of semiconductor innovation.