Microsanj Leads the Way in Thermal & Packaging Innovation at IEEE iTHERM 2025!
The packaging and thermal management industry is heating up, and Microsanj is proud to be leading the charge.
Microsanj was proud to serve as a Panel Sponsor at IEEE iTherm last month and also participated in the HIR Workshop and ECTC. As we continue driving innovation in microelectronics reliability and performance, our Co-Founder and CEO, Dr. Mo Shakouri, had the opportunity to connect with Andrew Tay of Thermo-Mechanical Technologies Pte. Ltd.—a packaging industry leader and one of our valued international representatives.
Our Advanced Optical Thermal Characterization Portfolio delivers unmatched precision for GaN, SiC, photonics, and 3DIC devices:
✅ SanjSCOPE™ – Submicron, picosecond transient analysis
✅ TDTR – Thin film & interface thermal property measurements
✅ OPP – 2D surface mapping for 3DICs & stacked die
✅ emSCOPE™ – Over-the-air EM thermal imaging
✅ irSCOPE™ & IMAG SANJ™ – IR imaging & wafer-level testing
Why choose Microsanj?
🔍 250nm spatial resolution
⚡ 500ps transient response
🔧 Seamless lab integration
🧠 Expert support & proven results
Join leading OEMs and researchers solving today’s toughest thermal challenges.