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ICEPT 2025
August 5 - August 7
The International Conference on Electronic Packaging Technology (ICEPT) is one of the largest and most cohesive packaging technology conferences in Asia. ICEPT 2025 will be held by Shanghai University, IEEE Electronics Packaging Society (IEEE-EPS), and Electronic Manufacturing & Packaging Technology Society of the Chinese Institute of Electronics (CIE-EMPT).
We’re excited to announce that Dr Andrew Tay, our international representative, will present an Invited Talk titled “Thermal and Failure Analysis of Advanced Microelectronic Devices” at ICEPT 2025 on August 7.
Drawing from over 35 years of experience, Andrew will cover real-world case studies in thermal and failure analysis of advanced microelectronic devices.