Microsanj is pleased to announce that we will be exhibiting in Hyderabad, India at MAPCON 2024, which will be held on December 9-13.
Come talk to representatives from Microsanj as we will be with our local India rep, Jyoti Electronics.
To learn more or to register, view the event website.
Microsanj will exhibit at Booth #1159 at IMS 2025 in San Francisco, CA! Stay tuned for more details!
Microsanj will exhibit at the EuMW 2025 in the Netherlands. Check back here for more details!
We are excited to announce that Microsanj will be a Platinum sponsor for the upcoming IEEE Paine Conference, taking place in Huntsville, AL this November. This prestigious event is a key gathering for professionals and experts in the fields of aerospace, defense, and electronics, offering a platform for groundbreaking discussions and innovations.
As a Platinum sponsor, Microsanj will have a prominent presence at the event. Be sure to stop by our table, where you can engage with our team of experts and learn more about our advanced thermal imaging solutions. Whether you're looking to enhance your thermal management strategies or want to explore the cutting-edge features of both our EZ-THERM and NanoTHERM systems, we’re here to answer all your questions and offer insights tailored to your specific needs.
We are excited about the opportunity to connect with industry leaders, and we look forward to sharing the latest developments in thermal analysis technology. Don’t miss this chance to engage with us directly and explore how Microsanj can support your innovations.
We look forward to seeing you in Huntsville!
We're thrilled to announce that Microsanj will be exhibiting at ISTFA 2024 in San Diego from October 28 to November 1. Stop by booth 317 for live demonstrations of our state-of-the-art EZ-THERM thermal imaging system, engineered for advanced thermal analysis of high-performance devices.
Here's what you can expect:
Live demos of the EZ-THERM system, highlighting its powerful capabilities for transient thermal analysis and real-time temperature mapping.
Meet with Microsanj representatives to discuss your specific thermal measurement needs and explore how our solutions can accelerate your design and analysis workflows.
Whether you’re working with high-power semiconductors, MMICs, or other complex devices, our team will be on hand to help you leverage precision thermal imaging for improved performance and reliability.
We look forward to seeing you at ISTFA 2024! Visit our booth for a hands-on demo and an in-depth conversation with our experts.
Register for a free exhibit hall with our code: EXH133520
Schedule a one-on-one session with our team by contacting us at info@microsanj.com
See you in San Diego!
Our international representative, Andrew Tay, will be attending the 2024 International Microsystems Packaging, Assembly, and Circuit Technology Conference (IMPACT2024) which will be held in Taipei. He has been invited to give a talk on the industrial testing of 3D heterogeneous chip-package-PCB-antenna modules using advanced electromagnetic-thermal analysis.
When: October 23, 13:30 -15:30
Where: Room 504C, TaiNEX 1
To learn more or to register, view the event website.
Our international representative, Andrew Tay, will be attending the 40th International Electronics Manufacturing Technology Conference (IEMT2024) in Penang, Malaysia. He has been invited to give a talk on the industrial testing of 3D heterogeneous chip-package-PCB-antenna modules using advanced electromagnetic-thermal analysis.
To learn more or to register, view the event website.
We are excited to announce that our partner, HITECH, is now a Silver Sponsor at the upcoming BITS & CHIPS Event, demonstrating their commitment to innovation and collaboration in the tech industry. Their support will be key to the event's success.
To learn more or to register, view the event website.
Our partner, eV-Technologies, will be delivering a presentation titled "Advanced EM-Thermal Correlation Technologies for Industrial Testing of 3D Antenna-In-Package (AiP) Modules."
To learn more or to register, view the event website.
We are excited to follow up on our invitation to meet the Microsanj team at InterPACK 2024! As a proud sponsor, we're eager to connect with you at our table, where we’ll be showcasing a live demo of our EZ-THERM system.
Don’t forget to attend Mo Shakouri’s presentation on "Advances in Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging." He will be speaking during the 03-09: Electronics Packaging - Thermal I session on October 9, from 3:50 PM to 5:15 PM.
With the conference happening in San Jose, we’d also love to host you at our Fremont lab—just a short 15-minute drive away. On Thursday, October 10, we will be offering live demonstrations of our NanoTHERM NT220 System both in the morning before the exhibition and after the exhibition. The system features the advanced Piezo Thermal Stage and cutting-edge submicron thermal analysis with 50-nanosecond resolution, integrated with the MPI Microwave/THz Probe Station and AMCAD Pulse IV system. This is an exclusive opportunity to see our latest thermal analysis tools in action!
If you’d like to schedule a lab visit or prefer other days next week, please reach out to us at info@microsanj.com. We look forward to seeing you at InterPACK and welcoming you to our lab!
We cordially invite you to visit the Microsanj joint booth (603H) with our partners, eV Technologies, MPI, and Synergie CAD, at the upcoming European Microwave Week (EuMW) 2024 in Paris, France. At EuMW, we will showcase our state-of-the-art thermal imaging systems and demonstrate how they can help you optimize the performance and reliability of your next-generation devices.
Here are a few highlights of the live demos you can expect at our joint booth:
Experience the EZ500 system's dual-mode thermoreflectance and infrared imaging capabilities for comprehensive thermal analysis.
Learn about our partnership with eV-Technologies and their emSCOPE™ solution, co-integrated with Microsanj systems, for non-invasive, high-resolution thermal imaging of electromagnetic fields in RF modules.
Explore Synergie CAD's RF industrial test solutions and their use of Microsanj's EZ500 for contactless thermal testing.
Attend Sidina Wane's featured presentation, where he will discuss the latest advancements in thermal imaging techniques and their applications in electronic device development.
As a special thank you for stopping by, we’ll be offering exclusive free giveaways. This is a great opportunity to connect with industry experts, learn about cutting-edge developments, and gain insights that can benefit your work.
Looking forward to seeing you at EuMW 2024!
For more information and to register, visit the EuMW 2024 Website
Our international representative, Andrew Tay from Thermo-Mechanical Technologies Pte. Ltd., will be giving a talk at the 25th International Conference on Electronic Packaging Technology. If you're in the area, don't miss his presentation on "Industrial Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules via Advanced Electromagnetic-Thermal Analysis" on August 8 from 15:00 to 15:30.
Visit the event website, for more details and registration.
Join Microsanj and our partnet eV-Technologies at IMS 2024 in Washington, DC! Drop by Booth #1407 for some free giveaways, and live demos, interact with our team, and participate in our half-day workshop and presentation titled "Advances in Thermal Analysis and Over-The-Air Electromagnetic Analysis of Advanced Microwave Devices and Front-End Modules."
When: Monday, June 17, 2024, from 1:30 PM - 5:20 PM EDT
Where: Location 146B
Narrated by Siding Wane, Mo Shakouri, Oren Eliezer
Details:
WMG-1: Sidina Wane, Mo Shakouri: A Holistic Near-Field Over-the-Air Approach for the Design, Testing, and Evaluation of Chip-Package-PCB-AiP Modules
Learn more about how Microsanj and eV-Technologies present comprehensive OTA testing solutions that integrate both functional and reliability testing.
WMG-2: Ali Shakouri: Overview of Thermal Characterization Techniques for Front-End Modules
Discover an overview of the three primary thermal imaging techniques and their associated imaging processes.
We will be showcasing a live demo of GaN. Additionally, we will have the NT220 on display.
Title: Advances in Thermal Analysis and Over-The-Air Electromagnetic Analysis of Advanced Microwave Devices and Front-End-Modules
When: Wednesday, June 19, 2024, at 4:30 PM EDT
Where: MicroApps Theater, Booth 2159
Narrated by Mo Shakouri & Sidina Wane
We will be raffling an Amazon Gift Card at the end of each exhibition day! Come by our booth to learn how you can win!
We are delighted to announce that our esteemed partner, HITECH, has taken on the role of a silver sponsor at the upcoming BITS and Chips Benelux RF Conference. This partnership underscores HITECH's commitment to advancing the field of radio frequency (RF) technology.
During the event, don't miss the insightful presentation by Dirk Faber, a leading expert from HITECH. His talk, titled "Thermal Measurement Solutions with Sub-Micron Spatial Resolution," promises to be both informative and engaging.
Join us for Dirk's presentation, scheduled from 1:30 PM to 2:30 PM. You'll have the opportunity to learn from his extensive experience and ask questions about the latest advancements in thermal measurement.
To learn more or to register, view the event website.
Microsanj is proud to announce that we are conference sponsors for iTherm 2024. If you are in the Denver region, check out iTherm as we will have Microsanj representatives attending the event.
To learn more or to register, view the event website.
Microsanj along with our partner, eV-Technologies are thrilled to announce our presence at the IEEE Texas Symposium 2024, taking place from April 3-4 in Waco, TX.
Join us to:
Witness a live joint demonstration showcasing the seamless integration of Microsanj and eV-Technologies with the Industrial Testing Platform
See a live presentation on EM-Thermal Correlation Technologies for Industrial-testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules
Discover more about our partnership with eV-Technologies
Engage in discussions with representatives from both Microsanj and eV-Technologies
We eagerly anticipate the opportunity to connect with you in Waco, TX!
Discover the latest innovations in thermal management and testing solutions at GOMACTech 2024 in Charleston, SC.
Join us at Booth #708 for live demos of the EZ-THERM system with TR+IR and insightful discussions with our representatives.
A Near-Field Over-the-Air Approach for the Design, Testing, and Evaluation of Chip-Package-PCB-AiP Modules
March 21 in Ballroom A from 3:30 PM-5:10 PM
Our partner, eV-Technologies will be at the 18th European Conference on Antennas and Propagation (EuCAP). Come see a joint-live demo with our partner eV-Technologies, talk to representatives from eV-Technologies, and learn more about Advanced Thermal-Imaging for OTA Industrial-Testing of Active-in-Package, Antenna-on-Chip and Antenna on PCB with our presentation.
To learn more or to register, view the event website.
At the German Microwave Conference, visit representatives from Microsanj and our local rep, HITECH to learn more about our thermal imaging solutions and products. Check back here for more details! For more information visit: German Microwave Conference Website or HITECH Website.
At SEMICON KOREA 2024, visit our local rep, ENSSEL at Booth B910 to learn more about our thermal imaging solutions and products. For more information visit: http://www.enssel.com or Overview | SEMICON Korea
Microsanj is pleased to announce that we will be exhibiting at Booth #100 on January 22-23 at the 2024 IEEE Radio & Wireless Week in San Antonio, TX. Come see a live demo of our EZ-Therm system with TR+IR and talk to representatives from Microsanj.
Visit our website to learn about the opportunities that will happen at RWW 2024!
To learn more or to register, view the event website.
View floorplan
Microsanj is pleased to announce that we will be exhibiting in India at MAPCOn 2023, which will be held on December 11-14.
Come talk to representatives from Microsanj and see a live demo of the EZ500, GaN amplifier, and Antennas. Additionally, our co-founder, President & CEO, Dr. Mo Shakouri will also be presenting “A Holistic Near-Field Over-the-Air Approach for the Design, Testing, and Evaluation of Chip-Package-PCB-AiP Modules.”
To learn more or to register, view the event website.
Microsanj is pleased to announce that we will be exhibiting as a gold sponsor for EPTC 2023, to be held on December 5-8 in Singapore.
Come talk to representatives from Microsanj at Booth # S3. Additionally, our co-founder, President & CEO, Dr. Mo Shakouri will also be presenting a technology talk on December 6th in the Grand Ballroom from 1:30-2:15 pm the “Challenges in the Analysis and Testing of Advanced Packaging Systems.”
To learn more or to register, view the event website.
Microsanj is set to participate in the 2023 IEEE Conference on Antenna Measurements and Applications, where we are scheduled to showcase a collaborative live demonstration with eV Technologies for emSCOPE. Additionally, we will present a collaborative session with eV Technologies, led by speakers Mo Shakouri and Sidina Wane, discussing "An Innovative Non-Invasive Analysis and Testing of Advanced Packaging Systems, Including Antenna-In-Package and Antenna-On-Chip Technologies."
To learn more or to register, view the event website.
Microsanj is pleased to announce our sponsorship and attendance for InterPACK 2023 to be held on October 24-26 in San Diego, CA. We recognize this conference as an important venue for discussing and exchanging information on electronics packaging and 3D heterogeneous integration. Microsanj recognizes the increasing thermal challenges posed by these advanced packaging techniques driven by 3DHI circuits.
Read more in our newsletter: https://www.microsanj.com/m-blogs/join-us-in-san-diego-for-interpack-2023
Event Website: https://event.asme.org/InterPACK
We are sponsoring the 2023 IEEE Paine Conference at the Westin in Huntsville, Alabama! Check back here for more details!
Harry Vine from Beacon Technical Sales, Inc. will be representing Microsanj at the 37th Annual Symposium and Mini-Show in New Jersey. Visit us to learn more about Microsanj products and services.
To learn more about this event, contact hvine@beacon-tech.com
Event Website: https://events.vtools.ieee.org/m/362122
Microsanj personnel will be at EUROPEAN MICROWAVE WEEK, in Berlin, GERMANY with a live demonstration showcasing the latest advances in thermal Imaging. We will be at BOOTH 104A with MPI-Corporation and ATV Systems and at BOOTH 555C WITH eV-Technologies.
Join us to discuss the thermal imaging challenges you are encountering with your advanced microwave devices, and we will show you how those challenges can be addressed with the latest thermal imaging enhancements built into our thermal imaging systems.
The ongoing thermal challenges due to decreasing device features and new materials with the need to also address the added complications arising from advanced packaging techniques requires continued advances in thermal analysis techniques to aid designers in their quest to optimize their designs for performance and reliability.
With added enhancements to our thermoreflectance-based imaging systems, Microsanj is taking the steps necessary to ensure designers have continued access to the most advanced thermal analysis techniques available to meet ever growing thermal challenges. EUROPEAN MICROWAVE WEEK provides the opportunity to learn about:
Optical Pump-Probing as an alternative for heating the device under test for assessing thermal conductivity and thermal resistance of thin films.
Our upgrade option, to achieve 500 picoseconds transient response for added flexibility with the analysis of multilayer structures.
Our emSCOPE™ system using a spin-crossover material in partnership with eV-Technologies for the measurement of electromagnetic fields for the analysis of Antennas-in-Package (AiP), Antennas-on-Chip (AoC), and many other Front-end-Modules (FEM). This other-the-air (OTA) holistic technique has the potential to revolutionize the approaches used for antenna analysis.
Our partnership with MPI Corporation supports high resolution wafer level thermal testing for high resolution failure analysis, defect mapping, wafer uniformity assessment.
Exhibit hours are:
Tuesday 19th Sep: 9.30 – 18.00
Wednesday 20th Sep: 9:30 – 17.30
Thursday 21st Sep: 9:30 – 16.30
Floorplan: https://www.expocad.com/host/fx/Horizon/23eumw/exfx.html
For more information about EuMW-2023 see: General Information (eumweek.com) or inquire at: info@microsanj.com
We look forward to meeting you at EuMW-2023!
Microsanj representatives will be participating in a joint presentation with Daniel Van Der Weide from the University of Wisconsin, “Advanced Thermal Imaging Can Resolve Short RF Pulse Effects in Tissue” on September 11 in the auditorium at the 2023 IEEE MTT-S International Microwave Biomedical Conference in Leuven, Belgium.
Event Website & Schedule: https://imbioc-ieee.esat.kuleuven.be/
Join us for an exciting presentation at Seoul National University in Korea by Dustin Kendig, Vice President & Co-Founder of Microsanj. Dustin will be presenting "Submicron Nanosecond Thermal Imaging using Thermoreflectance: Advancements and Applications" from 11:30 am to 12:00 pm KST. Don't miss this opportunity!
Dr. Mo Shakouri will be presenting, “Full-field transient thermal imaging for 3D IC meteorology” during the half day workshop Emerging Thermal Meteorology Needs for 3DHI Microsystems on Thursday (August 24, 2023).
For more details, visit the website: https://eri-summit.darpa.mil/2023-agenda
Microsanj is excited to announce its participation in the International Microwave Symposium 2023 in San Diego, CA.
Microsanj (#1452) will participate in live demos in 3 different booths with MPI (#723) and eV-Technologies (#2208) featuring:
EM-THERMAL OTA-Testing
UNIFIED SUB-10GHz, mmWave, and OPTICS Testing solutions
On-wafer thermal testing
Optical pump-probe
500 picosecond solutions.
Dustin Kendig will present "Thermal and Electromagnetic Analysis of Advanced Microwave Devices and Systems," with eV-Technologies on June 14th at 10:45 am at the MicroApps Theater, Booth 2447
Visitors at the booth (#1452) will also have a chance to win an iPad on June 13th and 14th at 4:00 pm (presence is required to win). For more details, please visit the event website.
Show Hours:
June 13, 2023 (Tuesday): 9:30 AM to 5:00 PM
June 14, 2023 (Wednesday): 9:30 AM to 6:00 PM
June 15, 2023 (Thursday): 9:30 AM to 3:00 PM
Microsanj will be at the Swedish Microwave Days 2023 (SMWD 2023) which is a three-day event at KTH in Stockholm. Talk with representatives from Microsanj and our European partner, HITECH as we will have a live demo of the EZ500 TR+IR. The event will be held from May 23-25 in the Electrum building in KIST. We look forward to seeing you there! For more information visit the event website.
