Our international representative, Andrew Tay from Thermo-Mechanical Technologies Pte. Ltd., will be giving a talk at the 25th International Conference on Electronic Packaging Technology. If you're in the area, don't miss his presentation on "Industrial Testing of 3D Heterogeneous Chip-Package-PCB-Antenna Modules via Advanced Electromagnetic-Thermal Analysis" on August 8 from 15:00 to 15:30.

Visit the event website, for more details and registration.