Microsanj is pleased to announce our sponsorship and attendance for InterPACK 2023 to be held on October 24-26 in San Diego, CA. We recognize this conference as an important venue for discussing and exchanging information on electronics packaging and 3D heterogeneous integration. Microsanj recognizes the increasing thermal challenges posed by these advanced packaging techniques driven by 3DHI circuits.

Read more in our newsletter: https://www.microsanj.com/m-blogs/join-us-in-san-diego-for-interpack-2023

Event Website: https://event.asme.org/InterPACK