Our international representative, Andrew Tay, will be attending the 2024 International Microsystems Packaging, Assembly, and Circuit Technology Conference (IMPACT2024) which will be held in Taipei. He has been invited to give a talk on the industrial testing of 3D heterogeneous chip-package-PCB-antenna modules using advanced electromagnetic-thermal analysis.

When: October 23, 13:30 -15:30

Where: Room 504C, TaiNEX 1

To learn more or to register, view the event website.