We are excited to follow up on our invitation to meet the Microsanj team at InterPACK 2024! As a proud sponsor, we're eager to connect with you at our table, where we’ll be showcasing a live demo of our EZ-THERM system.

Don’t forget to attend Mo Shakouri’s presentation on "Advances in Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging." He will be speaking during the 03-09: Electronics Packaging - Thermal I session on October 9, from 3:50 PM to 5:15 PM.

With the conference happening in San Jose, we’d also love to host you at our Fremont lab—just a short 15-minute drive away. On Thursday, October 10, we will be offering live demonstrations of our NanoTHERM NT220 System both in the morning before the exhibition and after the exhibition. The system features the advanced Piezo Thermal Stage and cutting-edge submicron thermal analysis with 50-nanosecond resolution, integrated with the MPI Microwave/THz Probe Station and AMCAD Pulse IV system. This is an exclusive opportunity to see our latest thermal analysis tools in action!

If you’d like to schedule a lab visit or prefer other days next week, please reach out to us at info@microsanj.com. We look forward to seeing you at InterPACK and welcoming you to our lab!