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The Future of Thermal Imaging

 

Our Mission

Our goal is to be a recognized technical leader in the field of high resolution thermal imaging based on the thermoreflectance principle. We are focused on the development of systems, products, and services for microelectronic and optoelectronic device and circuit thermal design and characterization. The Microsanj engineering team is continuously working on the development of product enhancements and alternative thermal image analyzer configurations to meet requirements ranging from; general purpose production testing and quality assurance to higher resolution systems with pico-second transient capability for more advanced research in the areas of nanodevice and defect thermal characterization.

Device performance requirements for today’s semiconductor and optoelectronic devices are leading to shrinking device geometries, new materials, new devices such as GaN and Ga2O3 HEMTs and other wide band-gap devices, and more complex 3-Dimensional multi-level structures, (3D-ICs). With micron and submicron-size features, today’s advanced devices can experience extremely high power densities with nanosecond scale time-dependent thermal events. Since high temperatures, high temperature gradients and even low power sub-micron hotspots can have a significant impact on mean-time-to-failure (MTTF), it is essential that one have a thorough understanding of both static and dynamic thermal performance. Microsanj thermal analysis systems are designed with nanoscale level thermal analysis capability to meet the increasing thermal imaging challenges presented by these advanced devices. With the ability to analyze fast thermal transient behavior, validate thermal modeling tools and detect the smallest semiconductor hotspots, a Microsanj thermal imaging system can ensure devices are designed with an optimal tradeoff between performance and reliability. Whether you are concerned with device and semiconductor failure analysis, optimal device design tradeoffs, or in-situ manufacturing process validation, a Microsanj thermal imaging system can be configured to meet the most stringent thermal analysis challenges.

 

Company Facts & Highlights

  • 2024/25: Evolving strategy and new products to address emerging thermal challenges driven by advances in heterogeneous packaging and embedded antennas with, Optical Pump-Probe imaging, Flash Thermography, 500 ps transient resolution, and emSCOPE™, an electromagnetic to thermal energy transducer for analysis of embedded antennas.

    The year 2024 marked the 15th anniversary of the first commercially available thermoreflectance system from Microsanj.

  • 2022/23: Microsanj enters alliances with eV-Technologies and MPI Corporation to broaden applications for thermoreflectance and infrared Imaging. The eV-Technologies alliance with Spin-Crossover materials provides a means for near and far-field over-the-air imaging of embedded microwave and millimeter-wave antennas. With MPI Microsanj SanjSCOPE products address auto-wafer thermal testing.

  • 2020/21: Microsanj introduces the SanjSCOPE™ EZ-THERM Series, a compact modular thermal imaging platform that can be integrated with an existing semiconductor test system and will simultaneously support up to three imaging sensors

  • 2018/19: Microsanj SanjSCOPE™ Thermal Imaging product line now comprises standard turnkey systems with multiple options to fit a wide range of customer thermal imaging performance requirements and applications. Introduced the first fully integrated Thermoreflectance + Infrared dual-mode thermal imaging system.

    More than 100 papers published, establishing Microsanj as a technology leader in the thermal imaging field.

  • 2016/17: Introduced several new key system features: TransientCAL™ for extended spatial resolution, hyperspectral imaging for enhanced temperature accuracy, and 3D nano-align for thermal drift compensation. Introduced a standalone post-data processing package, SanjANALYZER-PLUS™, to support the latest features and added flexibility.

  • 2014: Introduction of NT410 (now PT410) Thermal Imaging System providing 800 ps time resolution with sub-micron spatial resolution.

  • 2014: Introduction of NT310 Near-IR Thermal Imaging System for flip-chip and through-the-substrate imaging.

  • 2012-2019: Establishment of sales/support network. Now have sales and technical support in Asia, Europe, Israel, Brazil, Canada, and the United States.

  • 2012: Formed a collaborative relationship with Thermal Engineering Associates (TEA) and Packaging Science Services (PSS). Known as the Microelectronic Design and Measurement Group (MDaM), this partnership provides a resource for a wide range of microelectronic design services.

  • 2009: Offered first commercial thermal imaging system based on the thermoreflectance technique.

  • 2007: The company was founded in the heart of Silicon Valley, Santa Clara, California.