Back to All Events

ISTFA 2019


  • Oregon Convention Center 777 Northeast Martin Luther King Junior Boulevard Portland, OR, 97232 United States (map)
ISTFA_2019_Hero_Blue.png

ISTFA 2019 will Oregon Convention Center in Portland, Oregon USA Microsanj will be in attendance at Booth 908. Stop by our booth to discuss your thermal imaging concerns and challenges with our technical staff and learn about new developments with our thermal imaging systems.

The advent of Artificial Intelligence and the promise of quantum computing are driving disruptive computing architectures. Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities

For more information about ISTFA 2019:

Earlier Event: October 7
InterPACK 2019
Later Event: May 4
May Live Webinars