InterPACK 2019 will be held in Anaheim, California USA at the Hilton Anaheim. Microsanj, a GOLD Sponsor for this event will be there to provide you the opportunity to discuss your thermal imaging challenges with members of our technical staff and to learn more about recent developments in thermal imaging.

InterPACK is the premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics packaging and heterogeneous integration. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). InterPACK is a systems-focused conference covering topics on Heterogeneous Integration, Servers of the Future, Edge and Cloud Computing, Internet of Things, Flexible and Wearable Electronics, Photonics and Optics, Power Electronics, Energy Conversion and Storage, and Autonomous, Hybrid, and Electric Vehicles.

For more information about InterPACK 2019 see: