Microsanj Showcases Thermal Imaging Solutions at InterPACK 2024

We are excited to share highlights from our successful participation at InterPACK 2024, held last week in San Jose, California. Microsanj had the privilege of both exhibiting and presenting at this prestigious event, which brought together global leaders in thermal management, electronics packaging, and advanced engineering solutions.

At our booth, we showcased a live demonstration of our revolutionary EZ-THERM system, a state-of-the-art tool designed to provide real-time, high-resolution thermal imaging for advanced electronic devices. The demo attracted significant interest from attendees, offering an interactive way to explore how our system helps address critical thermal management challenges in cutting-edge applications, including heterogeneous packaging, high-power MMICs, and GaN/GaAs devices.

In addition to the exhibit, Mo Shakouri, our esteemed Chief Technology Officer, delivered an insightful technical presentation titled: "Advances in Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging."

Mo's presentation covered the latest innovations in thermal analysis, highlighting how the increasing complexity of heterogeneous integration and multi-chip packaging is driving the need for advanced, precise thermal management solutions. The session was well-received and fostered a lively discussion on the emerging needs of the electronics packaging industry.

We were thrilled with the opportunity to engage with industry peers, share our latest innovations, and form new connections with thought leaders and innovators. Events like InterPACK allow us to showcase not only our cutting-edge technologies but also our ongoing commitment to driving innovation in thermal analysis and management.

We want to thank everyone who visited our booth and attended the presentation. If you weren’t able to join us in San Jose, we’d be happy to provide more information about our EZ-THERM system and other advanced thermal solutions. Please don’t hesitate to reach out to us for a follow-up discussion or a personalized demo.

Looking forward to continuing the conversation and exploring exciting new possibilities in thermal management!