Microsanj Exhibits as Platinum Sponsor at IEEE PAINE 2024!
Exciting Conference Participation
Microsanj proudly served as a Platinum sponsor for the 2024 IEEE Physical Assurance and Inspection of Electronics (PAINE) Conference, held in Huntsville, Alabama. Our team engaged with leading experts in hardware security and trust, showcasing our cutting-edge thermal imaging technologies.
Key Conference Highlights
Our table was a focal point for professionals interested in advanced thermal analysis solutions, featuring:
Demonstrations of EZ-THERM
High-resolution thermal imaging technologies
Expertise in device thermal and material characterization
Technical Insights
Attendees explored our capabilities in:
Sub-250 nm spatial resolution imaging
0.1 °C thermal resolution
500 ps transient response technology
Comprehensive thermal analysis for advanced electronics
Thermal imaging plays a crucial role in semiconductor assurance by detecting localized hot spots on semiconductor devices, which can indicate potential defects such as faulty connections, manufacturing issues, or design flaws. This enables early identification and correction during production and quality control processes.
Microsanj's technologies utilize advanced techniques, such as lock-in thermography, to achieve high-sensitivity measurements of fast temperature variations. This non-destructive method allows for detailed analysis of heat distribution across the chip surface, pinpointing problematic areas without damaging the device.
Networking and Collaboration
The conference provided an exceptional platform to connect with:
Government officials
Academic researchers
Instrumentation specialists
Original component manufacturers (OCMs)
Original equipment manufacturers (OEMs)
Looking Forward
Microsanj remains committed to pushing the boundaries of thermal imaging and hardware security technologies. We look forward to continued innovation and collaboration in the field of electronics inspection and trust.
Stay Connected
Want to learn more about our breakthrough thermal imaging solutions? Contact our team for the latest developments.