Microsanj Thermal Imaging Solutions Address Semiconductor Thermal Challenges in the 5G Era

Driven by the need for higher power and higher frequency performance, from hand-sets to base stations, 5G and 6G applications are faced with significant thermal challenges. Challenges, if unmet, that can lead to under-performance and poor reliability.

Microsanj, recognizing the need to address these challenges at the chip level, offers a customer-configurable advanced thermal imaging and analysis system with the functionality necessary for gaining a full understanding of static and time-dependent device thermal behavior. Information that is essential for ensuring long-term reliability and optimal performance of devices and components for 5G, 6G and other high reliability applications.