Submicron Nanosecond Thermoreflectance Imaging for Thermal and Failure Analysis
Summary: Performance requirements for today’s semiconductor and optoelectronic devices are leading to shrinking geometries, more complex 3-dimensional structures, and new materials. In addition to increasing power densities, devices are being deployed in mission-critical applications ranging from 5G and 6G millimeter wave communication and Smart Grid networks, to automotive and defense electronics. Devices may also be required to operate in a challenging thermal environment. High temperatures, hot spots and temperature spikes can have a major impact on reliability. Since high temperatures contribute to MTTF, it is essential that one have a thorough understanding of static and dynamic thermal performance. Fortunately, advances in characterization techniques and thermal testing services are making it easier to gain this understanding to ensure reliability while meeting challenging performance requirements.
Gaining a thorough understanding of device thermal behavior under operating and static conditions has traditionally been complex, time consuming, and often lacked the resolution required to detect thermal anomalies that could lead to early device failures. Additionally, the recently passed CHIPS Act can also be expected to increase requirements for efficient thermal analysis and testing. Fortunately, advances in thermal imaging techniques that combine the benefits of thermoreflectance-based analysis with illumination wavelengths from near-ultraviolet to near infrared coupled with infrared thermography can support thermal, spatial, and transient resolution consistent with today’s advanced complex device structures and shrinking geometries. In addition, equipment has advanced to considerably reduce the time and cost to get accurate results. Many examples will be shared to fully illustrate the device thermal behaviors that can be detected with these advanced thermal analysis techniques.