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X-WR-CALDESC:Events for Microsanj
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DTSTART;VALUE=DATE:20260415
DTEND;VALUE=DATE:20260416
DTSTAMP:20260408T174134Z
CREATED:20260323T212216Z
LAST-MODIFIED:20260408T174134Z
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SUMMARY:Technical Webinar — April 15\, 2026 (Nanosecond & Picosecond Pump-Probe Techniques For Thermal Characterization of Advanced Packages)
DESCRIPTION:Nanosecond and picosecond pump-probe techniques for thermal characterization of advanced packages — real measurement data\, external speakers\, live Q&A.\n\n\n\n\nEvent Details\n\nDate: Wednesday\, April 15\, 2026\nLocation: Virtual\nTime: 7:00 AM – 8:00 AM PDT & 7:00 PM – 8:00 PM PDT\n\n\n\n\nLearn More & Register Now
URL:https://microsanj.com/events/technical-webinar-april-15-2026-optical-sampling-thermoreflectance-for-3d-heterogeneous-integration/
CATEGORIES:Webinar
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20260427
DTEND;VALUE=DATE:20260429
DTSTAMP:20260408T144754Z
CREATED:20260226T175334Z
LAST-MODIFIED:20260408T144754Z
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SUMMARY:Industry Day and Birck Research Symposium 2026
DESCRIPTION:Microsanj is proud to be a Gold Sponsor for the 2nd annual symposium. We will be exhibiting our latest systems and speaking on our collaborations within the nanotechnology ecosystem. Visit our booth to see our EZ500 live demo\, featuring high-resolution thermal imaging solutions that utilize advanced thermoreflectance and infrared (IR+TR) technology. These innovations are designed to enhance semiconductor testing\, RF analysis\, and materials research. \nOur Co-Founder & CEO\, Mo Shakouri\, will also be presenting: \nMeeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques. \n\n4/27\, 10:30 AM – 11:10 AM\nBurton Morgan Center for Entrepreneurship\, MRGN 121\n\nThe Birck Research Symposium is a one-day event showcasing cutting-edge innovation in nanoscience and advanced technology at the Birck Nanotechnology Center at Purdue University. Bringing together researchers\, students\, and industry professionals\, the symposium features research presentations\, keynote talks\, and networking opportunities designed to spark collaboration and highlight breakthrough discoveries. The event takes place at the Hall for Discovery and Learning Research in West Lafayette\, Indiana. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/industry-day-and-birck-research-symposium-2026/
LOCATION:Birck Nanotechnology Center\, 1205 W State St\, West Lafayette\, IN\, 47907
CATEGORIES:Symposium
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DTSTART;VALUE=DATE:20260429
DTEND;VALUE=DATE:20260501
DTSTAMP:20260311T165238Z
CREATED:20260311T165006Z
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SUMMARY:SEMIEXPO Heartland 2026
DESCRIPTION:Dr. Mo Shakouri will be a part of Session 3: Thermal Management & Power Delivery in Advanced Packaging: From TIMs to Warpage Control by presenting Meeting Emerging Thermal Challenges of 3D Heterogeneously Integrated Circuit Packaging Techniques on Thursday\, April 30\, from 10:05 AM – 10:25 AM. \nSEMIEXPO Heartland 2026 brings together the automotive and semiconductor ecosystems to explore the technologies redefining mobility and manufacturing. From software-defined and self-driving vehicles to electrified mobility\, the event highlights how cutting-edge chip technologies\, smart sensing systems\, and artificial intelligence are powering the next generation of transportation. Through a dynamic lineup of keynotes\, expert presentations\, and panel discussions\, attendees will exchange perspectives on the trends shaping the future—while actively contributing to the conversation. \nRegister Now \nSchedule a meeting with us
URL:https://microsanj.com/events/semiexpo-heartland-2026/
LOCATION:Detroit Marriott at the Renaissance Center\, Renaissance Center\, 400 Renaissance Dr W\, Detroit\, MI\, 48243\, United States
CATEGORIES:Trade Shows
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