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X-WR-CALDESC:Events for Microsanj
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DTSTART;VALUE=DATE:20251104
DTEND;VALUE=DATE:20251106
DTSTAMP:20251006T205458Z
CREATED:20250825T154306Z
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SUMMARY:PIC Summit Europe
DESCRIPTION:The photonic chip industry is reaching new heights – but scaling production\, applications\, and investments requires a united effort. As demand surges for high-speed\, energy-efficient solutions\, the question isn’t if photonic chips will revolutionise industries\, but how fast we can make it happen.  \nAt PIC Summit Europe 2025\, we bring together an entire ecosystem of designers\, foundries\, integrators\, OEMs\, investors\, and thought leaders to tackle the industry’s biggest challenges and opportunities. From advancing manufacturing capacity to expanding market applications and securing funding for growth\, this event is where the photonic chip industry aligns its vision for the future. \nMicrosanj is proud to sponsor our partner CN Rood at this event\, where they will showcase Microsanj’s advanced thermal imaging and analysis solutions for photonic and semiconductor device research. Attendees can explore how Microsanj’s high-resolution\, non-contact thermoreflectance systems deliver precise thermal characterization—critical for optimizing the performance and reliability of photonic chips and integrated devices.
URL:https://microsanj.com/events/pic-summit-europe/
LOCATION:Evoluon\, Noord Brabantlaan 1A 5652\, LA Eindhoven\, Netherlands
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/08/Main_PS_logo_dark_background_600px.png
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20251116
DTEND;VALUE=DATE:20251121
DTSTAMP:20251028T145506Z
CREATED:20250407T172334Z
LAST-MODIFIED:20251028T145506Z
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SUMMARY:ISTFA 2025
DESCRIPTION:Microsanj will join the 51st International Symposium for Testing and Failure Analysis (ISTFA) in Pasadena\, CA. As the premier event for the microelectronics failure analysis community\, ISTFA offers a platform for innovation and collaboration. \nVisit Microsanj at Booth #714 to experience a live demonstration of our EZ-THERM system\, showcasing open test and the powerful combination of Infrared (IR) and Thermoreflectance (TR) thermal analysis. Discover how our advanced tools provide precise\, non-invasive thermal characterization for today’s high-performance devices. Please speak with our experts to discuss how Microsanj solutions can support your specific research and reliability needs. \nView Floorplan
URL:https://microsanj.com/events/istfa-2025/
LOCATION:Pasadena Convention Center\, 300 E Green St\, Pasadena\, CA\, 91101\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/04/ISTFA-Logo.png
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BEGIN:VEVENT
DTSTART;VALUE=DATE:20251120
DTEND;VALUE=DATE:20251122
DTSTAMP:20251028T145435Z
CREATED:20251028T145355Z
LAST-MODIFIED:20251028T145435Z
UID:1682-1763596800-1763769599@microsanj.com
SUMMARY:IEEE REPP Symposium 2025
DESCRIPTION:The 2025 IEEE REPP is a two-day technical event focused on Reliability for Electronics and Photonics Packaging and is taking place at the SEMI Headquarters in Milpitas\, CA! \nMicrosanj is excited to announce that we are a silver sponsor for this event\, and our very own Dustin Kendig will be presenting “Thermal Analysis Techniques to Address the Growing Thermal Challenges with Heterogeneous Packaging” on 11/21 at 1:45 PM.
URL:https://microsanj.com/events/ieee-repp-symposium-2025/
LOCATION:SEMI Headquarters\, 673 S Milpitas Blvd\, Milpitas\, CA\, 95035\, United States
CATEGORIES:Symposium
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