BEGIN:VCALENDAR
VERSION:2.0
PRODID:-//Microsanj - ECPv6.18.1//NONSGML v1.0//EN
CALSCALE:GREGORIAN
METHOD:PUBLISH
X-WR-CALNAME:Microsanj
X-ORIGINAL-URL:https://microsanj.com
X-WR-CALDESC:Events for Microsanj
REFRESH-INTERVAL;VALUE=DURATION:PT1H
X-Robots-Tag:noindex
X-PUBLISHED-TTL:PT1H
BEGIN:VTIMEZONE
TZID:UTC
BEGIN:STANDARD
TZOFFSETFROM:+0000
TZOFFSETTO:+0000
TZNAME:UTC
DTSTART:20240101T000000
END:STANDARD
END:VTIMEZONE
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251014
DTEND;VALUE=DATE:20251017
DTSTAMP:20251006T205317Z
CREATED:20250711T175648Z
LAST-MODIFIED:20251006T205317Z
UID:1490-1760400000-1760659199@microsanj.com
SUMMARY:IEEE PAINE 2025
DESCRIPTION:The IEEE PAINE Conference brings together researchers and practitioners from academia\, industry\, and government to address advances in hardware security\, inspection\, and supply chain assurance of electronics. \nAs a Platinum Sponsor\, Microsanj will host a booth highlighting its newly released POSH-TDTR ultrafast thermoreflectance system\, designed for advanced thermal characterization. \nIn addition\, Mo Shakouri\, Ph.D.\, Founder & CEO of Microsanj\, will deliver the talk:\n“Buried Truths: Limitations and Opportunities in Non-Invasive Thermal Analysis for 2.5D/3D ICs” — offering insights into the opportunities and challenges of optical thermal analysis for reliability assurance and failure analysis of advanced integrated circuits. \n“IEEE PAINE brings together metrologists\, security researchers\, and test houses to explore the latest industry trends. We’re thrilled to have Microsanj showcase their exciting work with our community.”\n— Navid Asadi\, Associate Professor\, Electrical and Computer Engineering\, University of Florida (affiliated with the Materials Science and Engineering Department) \nRegister Now
URL:https://microsanj.com/events/ieee-paine-2025/
LOCATION:Denver Marriott Westminster\, 7000 Church Ranch Boulevard\, Westminster\, CO\, 80021\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/jpeg:https://microsanj.com/wp-content/uploads/2025/07/PAINElogo.jpg
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251021
DTEND;VALUE=DATE:20251025
DTSTAMP:20251013T145016Z
CREATED:20250711T184812Z
LAST-MODIFIED:20251013T145016Z
UID:1504-1761004800-1761350399@microsanj.com
SUMMARY:IMPACT 2025
DESCRIPTION:IMPACT 2025 adopts the theme “Energy-Efficient AI: From Cloud to Edge\,” reflecting the industry’s increasing focus on high-performance\, low-power solutions. As AI applications continue to expand—from data centers to edge devices—the need for advanced PCB\, IC substrates\, heterogeneous integration\, and packaging technologies has become increasingly critical. \nPresentation AnnouncementSpeaker: Andrew TaySession: S15 – Power ElectronicsDate & Time: Wednesday\, October 22 | 10:10–10:40 AMTitle: Thermal and Failure Analysis of Advanced Microelectronic Devices \nOur rep\, Andrew Tay\, will explore advanced thermal analysis techniques for today’s high-power\, miniaturized devices. His talk highlights how thermoreflectance thermography enables sub-micron\, picosecond-resolution mapping to reveal hotspots and characterize thermal behavior non-destructively. He will also present a novel method using quantum spin crossover (SCO) materials to correlate electromagnetic power with temperature—offering a faster\, cost-effective approach for antenna field analysis—supported by real-world case studies.
URL:https://microsanj.com/events/impact-2025/
LOCATION:Private: 5F Taipei Nangang Exhibition Center (Hall 1)\, No.1\, Jingmao 2nd Rd.\, Nangang District\, Taipei City\, 11568\, Taiwan
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/07/logo.png
END:VEVENT
BEGIN:VEVENT
DTSTART;VALUE=DATE:20251028
DTEND;VALUE=DATE:20251031
DTSTAMP:20251006T205448Z
CREATED:20250407T172931Z
LAST-MODIFIED:20251006T205448Z
UID:1394-1761609600-1761868799@microsanj.com
SUMMARY:InterPACK 2025
DESCRIPTION:As a Silver Sponsor of InterPACK\, the premier international conference on electronics packaging and heterogeneous integration\, Microsanj will showcase live demonstrations of its POSH-TDTR platform and GaN thermal analysis solutions. \nConference attendees can experience firsthand how Microsanj’s tools deliver high-resolution insights for addressing device and packaging-level thermal challenges. \nRegister Now
URL:https://microsanj.com/events/interpack-2025/
LOCATION:Hotel FERA Anaheim\, a DoubleTree by Hilton\, 100 The City Dr S\, Orange\, CA\, 92868\, United States
CATEGORIES:Trade Shows
ATTACH;FMTTYPE=image/png:https://microsanj.com/wp-content/uploads/2025/04/InterPACK-Logo.png
END:VEVENT
END:VCALENDAR